The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Feb. 26, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Takashi Kondo, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); H01L 21/3065 (2006.01); H01J 37/32 (2006.01); H05H 1/46 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32136 (2013.01); H01J 37/3266 (2013.01); H01J 37/32091 (2013.01); H01J 37/32568 (2013.01); H01J 37/32642 (2013.01); H01J 37/32669 (2013.01); H01L 21/3065 (2013.01); H01L 21/31116 (2013.01); H01L 21/67069 (2013.01); H01L 21/6831 (2013.01); H05H 1/46 (2013.01); H01J 2237/334 (2013.01); H05H 2001/4667 (2013.01);
Abstract

Disclosed is a plasma processing apparatus for performing a processing on a processing target substrate by applying of plasma of a processing gas to the processing target substrate. The plasma processing apparatus includes: a processing container configured to removably accommodate the processing target substrate; a lower electrode provided in the processing container to place the processing target substrate thereon; an upper electrode provided in the processing container to face the lower electrode; a high frequency power source configured to apply a high frequency power between the upper electrode and the lower electrode; and an electromagnet having one or more annular coils around a central axis that passes through a center of the lower electrode vertically in an upper portion or at an upper side of the processing container.


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