The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Mar. 31, 2015
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventor:
Tomoharu Fujii, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0006 (2013.01); H01F 2017/0066 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A passive device substrate includes a substrate, a passive device disposed at a first surface of the substrate, an insulating layer disposed on the first surface of the substrate to cover the passive device, a magnetic layer disposed on an opposite side of the insulating layer from the substrate to overlap the passive device in a plan view taken in a thickness direction of the substrate, and a metal layer disposed on a second surface of the substrate to overlap the passive device in the plan view.