The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Nov. 01, 2017
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Daisuke Yamauchi, Osaka, JP;
Hiroyuki Tanabe, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G11B 5/486 (2013.01); H05K 1/028 (2013.01); H05K 1/0242 (2013.01); H05K 2201/09236 (2013.01);
Abstract
A wired circuit board includes an insulating layer and a plurality of wires disposed at one-side surface in a thickness direction of the insulating layer at spaced intervals to each other. The plurality of wires have one pair of wires in parallel, the plurality of wires continuously have a first portion and a second portion in which the total sum of a line width of one wire of one pair of wires and an interval between one pair of wires is smaller than that of the first portion, and a thickness Tof the first portion is large with respect to a thickness Tof the second portion.