The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Jun. 25, 2015
Ngk Insulators, Ltd., Nagoya, JP;
Osaka Alloying Works, Co., Ltd., Fukui, JP;
Minoru Uda, Nagoya, JP;
Takahiro Ishikawa, Toyoake, JP;
Taiji Mizuta, Kyoto, JP;
Yasunari Mizuta, Fukui, JP;
Hiroyasu Taniguchi, Sakai, JP;
NGK Insulators, Ltd., Nagoya, JP;
Osaka Alloying Works, Co., Ltd., Fukui, JP;
Abstract
The copper alloy of the present invention contains 5% by mass to 25% by mass of Ni, 5% by mass to 10% by mass of Sn, 0.005% by mass to 0.5% by mass of element A (element A being at least one selected from the group consisting of Nb, Zr and Ti), and 0.005% by mass or more of carbon. In the copper alloy, the mole ratio of the carbon to the element A is 10.0 or less. The copper alloy may further contain 0.01% by mass to 1% by mass of Mn. In this copper alloy, the element A may be present as carbide.