The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Oct. 31, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Hyeon-jin Shin, Suwon-si, KR;
Jae-young Choi, Suwon-si, KR;
Gang-hee Han, Suwon-si, KR;
Young-hee Lee, Seongnam-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01); B32B 37/10 (2006.01); B32B 37/12 (2006.01); B32B 37/14 (2006.01); B32B 37/26 (2006.01); B32B 38/10 (2006.01); C01B 31/04 (2006.01); B32B 7/06 (2006.01); B32B 7/12 (2006.01); B32B 27/28 (2006.01); G09F 3/10 (2006.01); H01L 21/683 (2006.01); B32B 27/40 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 15/08 (2006.01); C23C 16/26 (2006.01); C23C 16/44 (2006.01); C01B 32/184 (2017.01); B29C 65/02 (2006.01); B32B 37/08 (2006.01);
U.S. Cl.
CPC ...
C01B 31/0446 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 27/28 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); B32B 38/10 (2013.01); C01B 32/184 (2017.08); C23C 16/26 (2013.01); C23C 16/44 (2013.01); G09F 3/10 (2013.01); H01L 21/683 (2013.01); Y10T 428/24612 (2015.01); Y10T 428/26 (2015.01); Y10T 428/30 (2015.01); Y10T 428/31511 (2015.04); Y10T 428/31551 (2015.04); Y10T 428/31663 (2015.04); Y10T 428/31678 (2015.04); Y10T 428/31855 (2015.04); Y10T 428/31971 (2015.04);
Abstract
A graphene laminate including a substrate, a binder layer on the substrate, and graphene on the binder layer, wherein the graphene is bound to the substrate by the binder layer.