The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Apr. 05, 2016
Applicant:
Disco Corporation, Tokyo, JP;
Inventors:
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); H01L 21/268 (2006.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0069 (2013.01); B23K 26/0622 (2015.10); B23K 26/0648 (2013.01); H01L 21/268 (2013.01); H01L 21/67115 (2013.01); H01L 21/687 (2013.01); B23K 2203/56 (2015.10);
Abstract
A focusing unit of a laser processing apparatus includes: a focusing lens that focuses a laser beam oscillated from a laser beam oscillating unit; and a spherical aberration extending lens that extends the spherical aberration of the focusing lens. A pulsed laser beam is applied from the focusing unit to a workpiece held on a chuck table, to form shield tunnels each composed of a fine hole and an amorphous region shielding the fine hole, the shield tunnels extending from an upper surface toward a lower surface of the workpiece.
Quick Actions:
Morikazu, Hiroshi. (2018). Laser processing apparatus (U.S. Patent No. 10071442). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10071442
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