The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Aug. 24, 2015
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Toshifumi Matsuyama, Tokyo, JP;

Hiromitsu Ueyama, Tokyo, JP;

Hayato Kiuchi, Tokyo, JP;

Koji Nanbu, Tokyo, JP;

Assignee:

Disco Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23D 59/02 (2006.01);
U.S. Cl.
CPC ...
B23D 59/025 (2013.01); Y10T 83/293 (2015.04);
Abstract

A cutting blade is held between a first flange and a second flange to define an annular cutting water supply chamber between the two flanges. The first flange has a plurality of cutting water supply holes, a first holding surface for holding one side surface of the cutting blade, and a plurality of first supply grooves formed on the first holding surface so as to extend in the radial direction of the first flange. The second flange has a second holding surface for holding the other side surface of the cutting blade and a plurality of second supply grooves extend in the radial direction of the second flange. Cutting water is supplied from the cutting water supply holes to the cutting water supply chamber and then discharged from the first supply grooves and the second supply grooves by centrifugal force due to rotation of a spindle.


Find Patent Forward Citations

Matsuyama, Toshifumi. (2018). Flange mechanism and cutting apparatus (U.S. Patent No. 10071433). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10071433

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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