The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

May. 18, 2016
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi Aichi-ken, JP;

Inventors:

Masahiro Sugimoto, Toyota, JP;

Sachiko Aoi, Nagakute, JP;

Shoji Mizuno, Kariya, JP;

Shinichiro Miyahara, Kariya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/10 (2006.01); H01L 29/423 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1083 (2013.01); H01L 29/42368 (2013.01); H01L 29/7811 (2013.01); H01L 29/7813 (2013.01); H01L 29/1095 (2013.01); H01L 29/1608 (2013.01);
Abstract

A semiconductor device is provided with a semiconductor substrate and a trench gate. The semiconductor substrate is provided with a drift region of a first conductive type, wherein the drift region is in contact with the trench gate; a body region of a second conductive type, wherein the body region is disposed above the drift region and is in contact with the trench gate; a source region of the first conductive type, wherein the source region is disposed above the body region, exposed on the front surface of the semiconductor substrate and is in contact with the trench gate; and a front surface region of the second conductive type, wherein the front surface region is disposed above the source region, exposed on the front surface of the semiconductor substrate and is in contact with the trench gate.


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