The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Oct. 22, 2015
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
David R. Hembree, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/38 (2006.01); H01L 21/56 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/563 (2013.01); H01L 23/38 (2013.01); H01L 25/18 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/26145 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1659 (2013.01); H01L 2924/16251 (2013.01);
Abstract
Apparatuses and methods for heat transfer from packaged semiconductor die are described. For example, an apparatus may include a plurality of die in a stack, and a barrier in close proximity to at least an edge of each of the plurality of die. The apparatus may further include fill material in spaces between adjacent die of the plurality of die and in between the plurality of die and the barrier.