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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10068854 B1

PDFFull Text
Date of Patent:
Sep. 04, 2018

Filed:

Oct. 24, 2016

Semiconductor package device and method of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Wei-Hsuan Lee, Kaohsiung, TW;

Jaw-Ming Ding, Kaohsiung, TW;

Wei-Yu Chen, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorneys:

Foley & Lardner LLP

Cliff Z. Liu

Primary Examiner:

David Zarneke

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/60 (2006.01); H01L 27/32 (2006.01); H01L 23/552 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/485 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/16155 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A semiconductor package device includes a substrate, a passive component, an active component and a package body. The passive component is disposed on the substrate. The active component is disposed on the substrate. The package body is disposed on the substrate. The package body includes a first portion covering the active component and the passive component, and a second portion covering the passive component. A top surface of the second portion of the package body is higher than a top surface of the first portion of the package body.

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Quick Actions:

Lee, Wei-Hsuan. (2018). Semiconductor package device and method of manufacturing the same (U.S. Patent No. 10068854). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10068854

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