The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Feb. 13, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Seiji Oka, Tokyo, JP;
Hiroshi Yoshida, Tokyo, JP;
Hidetoshi Ishibashi, Tokyo, JP;
Yuji Imoto, Tokyo, JP;
Daisuke Murata, Tokyo, JP;
Kenta Nakahara, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/10 (2006.01); H01L 23/057 (2006.01); H01L 23/31 (2006.01); H01L 25/07 (2006.01); H01L 21/52 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H02M 7/537 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 21/4817 (2013.01); H01L 21/52 (2013.01); H01L 21/565 (2013.01); H01L 23/057 (2013.01); H01L 23/3114 (2013.01); H01L 25/071 (2013.01); H02M 7/537 (2013.01);
Abstract
A relay substrate in which a circuit pattern and an external electrode are integrated on a insulating plate is used in the semiconductor device. Such configuration makes it possible to reduce a resistance in a current path while preventing the problems occurring when the external electrode is soldered on the semiconductor chip.