The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

May. 19, 2017
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Daniel B. Penney, Wylie, TX (US);

Guy S. Perry, Plano, TX (US);

Harish N. Venkata, Allen, TX (US);

Glen E. Hush, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 29/00 (2006.01);
U.S. Cl.
CPC ...
G11C 29/886 (2013.01); G11C 29/702 (2013.01); G11C 29/74 (2013.01); G11C 29/785 (2013.01); G11C 29/838 (2013.01); G11C 29/86 (2013.01);
Abstract

Apparatuses and methods related to column repair in memory are described. An apparatus can include sensing circuitry. The sensing circuitry can include a first sensing component, a second sensing component, and a third sensing component. The second sensing component can include a defective sense amplifier that is column repaired. The apparatus can include a controller configured to use the sensing circuitry to shift data from the first sensing component to the third sensing component by transferring the data through the second sensing component. The second sensing component can be physically located between the first sensing component and the third sensing component.


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