The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

May. 03, 2018
Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventors:

Akira Hisano, Ibaraki, JP;

Yuichiro Nakamura, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); C23C 14/34 (2006.01); C23C 14/08 (2006.01); C04B 35/645 (2006.01); C04B 35/053 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3407 (2013.01); C04B 35/053 (2013.01); C04B 35/645 (2013.01); C23C 14/081 (2013.01); C23C 14/3414 (2013.01); C04B 2235/442 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/721 (2013.01); C04B 2235/77 (2013.01); C04B 2235/81 (2013.01); C04B 2235/9646 (2013.01); C04B 2235/9661 (2013.01);
Abstract

A sintered compact magnesium oxide target for sputtering has a purity of 99.99 wt % or higher excluding C, a density of 3.57 g/cmor higher, and a whiteness of 60% or less. To uniformly deposit a magnesium oxide film, a magnesium oxide target having a higher purity and a higher density is demanded. An object is to provide a target capable of realizing the above and a method for producing such a target. While a magnesium oxide sintered compact sputtering target is produced by hot-pressing a raw material powder, there is a problem in that color shading occurs in roughly φ60 (within a circle having a diameter of 60 mm) at the center part of the target. Conventionally, no particularly attention was given to this problem. However, in recent years, it has become necessary to investigate and resolve this problem in order to improve the deposition quality.


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