The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10063282 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 28, 2018

Filed:

Jul. 24, 2017
Applicant:

I-shou University, Kaohsiung, TW;

Inventors:

Yu-Jung Huang, Kaohsiung, TW;

Mei-Hui Guo, Kaohsiung, TW;

Assignee:

I-SHOU UNIVERSITY, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 5/00 (2006.01);
U.S. Cl.
CPC ...
H04B 5/0012 (2013.01);
Abstract

A chip-to-chip signal transmission system including a first unit set and a second unit set arranged in a first direction is provided. The first unit set and the second unit are configured to perform the signal transmission between a first chip and a second chip. There is a shift between the first unit set and the second unit set in a second direction such that the first unit set and the second unit set are shifted in the second direction and an overlapping region is formed. By adjusting the size of the overlapping region, the signal noise and the signal attenuation due to the misalignment between the first chip and the second chip or the electromagnetic interference of the adjacent signals are reduced and the signal transmission quality is thus improved. Furthermore, a method for arranging chips is also provided.


Find Patent Forward Citations

Huang, Yu-Jung. (2018). Chip-to-chip signal transmission system and method for arranging chips thereof (U.S. Patent No. 10063282). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10063282

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