The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2018
Filed:
Sep. 10, 2016
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventor:
Tzung-Lin Li, Hsinchu, TW;
Assignee:
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/082 (2013.01); H01P 3/08 (2013.01); H01P 11/003 (2013.01);
Abstract
A method for fabricating microstrip line structure is disclosed. First, a substrate is provided, ground patterns are formed on the substrate, an interlayer dielectric (ILD) layer is formed on the ground patterns, contact plugs are formed in the ILD layer, a ground plate is formed on the ILD layer, and a signal line is formed on the ground plate. Preferably, the ground plate includes openings that are completely shielded by the ground patterns.
Quick Actions:
Li, Tzung-Lin. (2018). Microstrip line structure and method for fabricating the same (U.S. Patent No. 10062943). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10062943
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile