The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Dec. 29, 2016
Applicants:

Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Inventors:

Tzu Yin Chiu, Shanghai, CN;

Clifford Ian Drowley, Shanghai, CN;

Leong Tee Koh, Shanghai, CN;

Yu Lei Jiang, Shanghai, CN;

Da Qiang Yu, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 27/11531 (2017.01); H01L 21/265 (2006.01); H01L 21/266 (2006.01); H01L 21/3213 (2006.01); H01L 21/762 (2006.01); H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 27/11524 (2017.01); H01L 29/04 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/16 (2006.01); H01L 29/161 (2006.01); H01L 29/167 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11531 (2013.01); H01L 21/266 (2013.01); H01L 21/26513 (2013.01); H01L 21/32139 (2013.01); H01L 21/76224 (2013.01); H01L 21/82345 (2013.01); H01L 21/823412 (2013.01); H01L 21/823418 (2013.01); H01L 21/823807 (2013.01); H01L 21/823814 (2013.01); H01L 21/823828 (2013.01); H01L 21/823864 (2013.01); H01L 21/823878 (2013.01); H01L 27/0922 (2013.01); H01L 27/11524 (2013.01); H01L 29/04 (2013.01); H01L 29/0649 (2013.01); H01L 29/0688 (2013.01); H01L 29/0847 (2013.01); H01L 29/1033 (2013.01); H01L 29/1083 (2013.01); H01L 29/1095 (2013.01); H01L 29/161 (2013.01); H01L 29/167 (2013.01); H01L 29/1608 (2013.01); H01L 29/66825 (2013.01);
Abstract

A method is provided for fabricating a buried-channel MOSFET and a surface-channel MOSFET of the same type and different gate electrodes on a same wafer. The method includes providing a semiconductor substrate having a well area and a plurality of shallow trench isolation structures; forming a threshold implantation region doped with impurity ions opposite of that of the well area in the well area for the buried-channel MOSFET; forming a gate structure including a gate dielectric layer and a gate electrode on the semiconductor substrate, wherein the gate electrode of the buried-channel MOSFET is doped with impurity ions with a same type as that of the well area, and the gate electrode of the surface-channel MOSFET is doped with impurity ions with a type opposite of that of the well area; and forming source and drain regions in the semiconductor substrate at both sides of the gate structure.


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