The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Dec. 21, 2016
Applicant:

Phoenix Pioneer Technology Co., Ltd., Hsinchu County, TW;

Inventors:

Shih-Ping Hsu, Hsinchu County, TW;

Chih-Kuai Yang, Hsinchu County, TW;

Assignee:

PHOENIX & CORPORATION, Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 25/0655 (2013.01); H05K 1/115 (2013.01); H05K 1/185 (2013.01); H01L 21/568 (2013.01); H05K 2201/10015 (2013.01);
Abstract

This disclosure provides a package substrate which includes: a first conductive layer having a first conductive area and a second conductive area; a package unit layer disposed on the first conductive layer and including a first circuit device having a first terminal connected to the first conductive area and a second terminal connected to the second conductive area, a first conductive pillar connected to the first conductive area, and an encapsulant material; and a second conductive layer disposed on the package unit layer and having a first metal wire connected to the first conductive pillar.


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