The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Dec. 10, 2014
Applicant:

Sumco Corporation, Tokyo, JP;

Inventors:

Takuro Iwanaga, Tokyo, JP;

Kazunari Kurita, Tokyo, JP;

Takeshi Kadono, Tokyo, JP;

Assignee:

SUMCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 21/322 (2006.01); H01L 29/36 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02658 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02447 (2013.01); H01L 21/02532 (2013.01); H01L 21/26506 (2013.01); H01L 21/26566 (2013.01); H01L 21/3221 (2013.01); H01L 29/36 (2013.01);
Abstract

Provided is a method of manufacturing an epitaxial wafer having an excellent gettering capability while suppressing formation of epitaxial defects. The method includes: a cluster ion irradiation step of irradiating a surface of a silicon wafer having a resistivity of from 0.001 Ω·cm to 0.1 Ω·cm with cluster ions containing at least carbon at a dose of from 2.0×10/cmto 1.0×10/cmto form, on a surface portion of the silicon wafer, a modifying layer composed of a constituent element of the cluster ions in the form of a solid solution; and an epitaxial layer forming step of forming, on the modifying layer on the silicon wafer, an epitaxial layer having a resistivity that is higher than the resistivity of the silicon wafer.


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