The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Dec. 03, 2013
Mitsubishi Materials Corporation, Tokyo, JP;
Hiroya Ishizuka, Kitamoto, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A manufacturing method of power-module substrate (), the power-module substrate () being obtained by joining a circuit layer () made of copper to one surface of a ceramic substrate () and joining a heat-radiation layer () made of aluminum to the other surface of the ceramic substrate (), including: a circuit layer bonding step in which the circuit layer () is brazed on the ceramic substrate (), a surface treatment step after the circuit layer bonding step in which a thickness of an oxide film on the other surface of the ceramic substrate () is made 3.2 nm or less at least at a peripheral part of an intended bonding area between the ceramic substrate () and the heat-radiation layer (), and a heat-radiation layer bonding step in which the heat-radiation layer () is brazed on the other surface of the ceramic substrate () after the surface treatment step.