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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10056453 B1

PDFFull Text
Date of Patent:
Aug. 21, 2018

Filed:

Jul. 22, 2016

Semiconductor wafers with reduced bow and warpage

Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Ajey Poovannummoottil Jacob, Watervliet, NY (US);

Srinivasa R. Banna, San Jose, CA (US);

Deepak K. Nayak, Union City, CA (US);

Bartlomiej J. Pawlak, Leuven, BE;

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:

Michael LeStrange

Andrew M. Calderon

Roberts Mlotkowski Safran Cole & Calderon, P.C.

Primary Examiner:

Long Pham

Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 23/00 (2006.01); H01L 29/20 (2006.01); H01L 29/16 (2006.01); H01L 29/267 (2006.01); H01L 21/02 (2006.01); H01L 21/308 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0657 (2013.01); H01L 21/0254 (2013.01); H01L 21/02381 (2013.01); H01L 21/3065 (2013.01); H01L 21/3083 (2013.01); H01L 23/562 (2013.01); H01L 29/16 (2013.01); H01L 29/2003 (2013.01); H01L 29/267 (2013.01);
Abstract

The present disclosure relates to semiconductor structures and, more particularly, to semiconductor wafers with reduced bowing and warping and methods of manufacture. The structure includes a substrate including plurality of trenches which have progressively different depths as they extend radially inwardly from an edge of the substrate towards a center of the substrate.

Find Patent Forward Citations

Jacob, Ajey. (2018). Semiconductor wafers with reduced bow and warpage (U.S. Patent No. 10056453). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10056453

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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