The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
May. 19, 2017
Nxp Usa, Inc., Austin, TX (US);
Alan J. Magnus, Gilbert, AZ (US);
NXP USA, INC., Austin, TX (US);
Abstract
An embedded component package includes an embedded component substrate. The embedded component substrate includes an electronic component having an active surface including bond pads and a package body encapsulating the electronic component. The package body includes a principle surface coplanar with the active surface, A localized redistribution layer (RDL) dielectric layer is on the active surface. A localized RDL conductive layer is on the localized RDL dielectric layer and is coupled to the bond pads through openings in localized RDL dielectric layer. A primary RDL dielectric layer encloses the entire embedded component substrate and directly contacts the localized RDL dielectric layer, the localized RDL conductive layer, and the principal surface of the package body. The localized RDL conductive layer provides additional space for routing of additional interconnects while the localized RDL dielectric layer acts as a stress buffer.