The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Jan. 29, 2016
Applicant:

Southeast University, Nanjing, CN;

Inventors:

Siyang Liu, Nanjing, CN;

Ning Wang, Nanjing, CN;

Jiaxing Wei, Nanjing, CN;

Chao Liu, Nanjing, CN;

Weifeng Sun, Nanjing, CN;

Shengli Lu, Nanjing, CN;

Longxing Shi, Nanjing, CN;

Assignee:

SOUTHEAST UNIVERSITY, Nanjing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/3121 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/17738 (2013.01); H01L 2924/17747 (2013.01);
Abstract

A power module of a square flat pin-free packaging structure for suppressing the power module from being excessively high in local temperature. The power module includes an insulating resin, a driving chip, a plurality of power chips, and a plurality of metal electrode contacts. The driving chip, the power chips, and the metal electrode contacts are electrically connected through a metal lead according to a predetermined circuit. A plurality of metal heat dissipating disks used for heat dissipation of the power chips and a driving chip lead frame are disposed at the bottom of the insulating resin. A plurality of metal power chip lead frames are disposed on the metal heat dissipating disks, the power chips are disposed on the power chip lead frames, and the drain electrodes of the power chips are electrically connected to the metal heat dissipating disks.


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