The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Jun. 14, 2017
Applicants:
Paul C. Lindsey, Jr., Lafayette, CA (US);
Darrell W. Foote, Walnut Creek, CA (US);
Inventors:
Paul C. Lindsey, Jr., Lafayette, CA (US);
Darrell W. Foote, Walnut Creek, CA (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/34 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01); H01L 21/321 (2006.01); H01L 21/683 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/3105 (2013.01); H01L 21/321 (2013.01); H01L 21/6835 (2013.01); H01L 23/544 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/5446 (2013.01);
Abstract
A method for improving the cleaving of the back metal along the edges of the die of a semiconductor wafer mounted on a deformable plastic film including the step of depositing a layer of material on metal located on the wafer back side in etched streets.
Lindsey, Jr., Paul. (2018). Modified plasma dicing process to improve back metal cleaving (U.S. Patent No. 10056297). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10056297
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile