The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Nov. 30, 2017
Applicant:

Korea Basic Science Institute, Daejeon, KR;

Inventors:

Dong Chan Seok, Daejeon, KR;

Yong Ho Jung, Seoul, KR;

Hyun Young Jeong, Gunsan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); H01J 37/32 (2006.01); H05H 1/48 (2006.01); B01J 19/08 (2006.01); H05H 1/24 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32568 (2013.01); B01J 19/088 (2013.01); H01J 37/32348 (2013.01); H05H 1/48 (2013.01); B01J 2219/0835 (2013.01); B01J 2219/0879 (2013.01); H05H 2001/2412 (2013.01);
Abstract

A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.


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