The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Mar. 18, 2016
Applicant:
Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;
Inventors:
Shota Katayama, Kanagawa, JP;
Aya Momozawa, Kanagawa, JP;
Assignee:
TOKYO OHKA KOGYO CO., LTD., Kawasaki-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/039 (2006.01); G03F 7/038 (2006.01); G03F 7/16 (2006.01); C08F 220/24 (2006.01); C08F 220/18 (2006.01); C08F 220/22 (2006.01); C08F 220/28 (2006.01); H01L 21/027 (2006.01); H01L 21/033 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0397 (2013.01); C08F 220/18 (2013.01); C08F 220/22 (2013.01); C08F 220/24 (2013.01); C08F 220/28 (2013.01); G03F 7/004 (2013.01); G03F 7/0046 (2013.01); G03F 7/0382 (2013.01); G03F 7/0392 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); H01L 21/0274 (2013.01); H01L 21/0337 (2013.01); H01L 21/31116 (2013.01); C07C 2603/18 (2017.05);
Abstract
A photosensitive resin composition, a method of manufacturing a substrate with a template using the composition, and a method of manufacturing a plated article using the substrate with a template. The photosensitive resin composition may be used to form a plated article on a metal surface of a substrate The composition includes an acid generator that, when irradiated with an active ray or radiation, generates an acid, a resin that, under an action of an acid, undergoes an increase in solubility thereof in alkali, and a fluorene compound represented by the formula (1).