The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Aug. 02, 2016
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Takashi Watanabe, Yokkaichi, JP;

Shunsuke Doi, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 53/00 (2006.01); B24B 53/017 (2012.01); B24B 37/20 (2012.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
B24B 53/017 (2013.01); B24B 37/20 (2013.01); H01L 21/30625 (2013.01);
Abstract

In one embodiment, a semiconductor manufacturing apparatus includes a polishing table configured to hold a polishing pad for polishing a substrate, and to rotate the polishing pad. The apparatus further includes a dressing module configured to hold a dresser for dressing the polishing pad, and to dress a surface of the polishing pad by sweeping the polishing pad with the dresser while rotating the dresser. The apparatus further includes a controller configured to control a number of revolutions of the polishing table based on a position of the dresser to the polishing table, while the polishing pad is dressed.


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