The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Aug. 29, 2013
Applicant:

Universal Instruments Corporation, Conklin, NY (US);

Inventor:

Koenraad Alexander Gieskes, Deposit, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 3/08 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); B23K 3/04 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
B23K 3/087 (2013.01); B23K 1/0016 (2013.01); B23K 3/04 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 25/50 (2013.01); B23K 2001/12 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/75272 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/8121 (2013.01); H01L 2224/81121 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01);
Abstract

Disclosed herein is a method that includes picking up a plate with a nozzle, the plate including at least one opening to allow air to flow therethrough. The method includes picking up a die with the nozzle such that the plate is located between the nozzle and the die. The method includes placing the die and the plate onto a device, substrate or another die such that the plate is located on top of the die. The method includes heating the device, substrate or another die and the die in a heat chamber while the plate remains on top of the die to permanently attach the die to the device, substrate or another die. Further disclosed herein is an assembly system configured to perform a method that utilizes the plate and die combination for attaching the die to a device, substrate or another die by heating.


Find Patent Forward Citations

Quick Actions:

Gieskes, Koenraad. (2018). 3d tsv assembly method for mass reflow (U.S. Patent No. 10052705). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10052705

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…