The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Jan. 25, 2017
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventor:

Teruyuki Ishihara, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01); H05K 3/40 (2006.01); H05K 3/06 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/0313 (2013.01); H05K 3/0032 (2013.01); H05K 3/061 (2013.01); H05K 3/4038 (2013.01); H05K 3/4647 (2013.01); H05K 2203/0597 (2013.01);
Abstract

A printed wiring board includes a conductor layer including a conductor circuit, a resin insulating layer formed on the conductor layer and having a via opening reaching to the conductor circuit of the conductor layer, and a via conductor formed in the via opening of the resin insulating layer such that the via conductor is connecting to the conductor circuit of the conductor layer. The conductor circuit of the conductor layer has a first conductor portion and a second conductor portion integrally formed such that the first conductor portion is connected to the via opening of the resin insulating layer, that the second conductor portion is surrounding the first conductor portion and that the first conductor portion has a thickness which is greater than a thickness of the second conductor portion.


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