The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Mar. 08, 2017
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventor:

Katsutoshi Kitagawa, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H05K 1/028 (2013.01); H05K 3/0011 (2013.01); H05K 3/4007 (2013.01);
Abstract

A wiring board includes a substrate, a surface protection film laminated on the substrate and having an opening portion, and a conductor block embedded in the substrate and having a pad portion exposed by the opening portion of the surface protection film. The conductor block has an annular groove formed such that the annular groove is surrounding the pad portion of the conductor block, and the surface protection film is formed such that a portion of the surface protection film is extending into the annular groove.


Find Patent Forward Citations

Kitagawa, Katsutoshi. (2018). Wiring board and method for manufacturing the same (U.S. Patent No. 10051734). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10051734

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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