The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Aug. 16, 2016
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Jun Abatake, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/09 (2006.01); H03H 9/05 (2006.01); H03H 9/54 (2006.01); H03H 3/02 (2006.01); H03H 9/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02047 (2013.01); H03H 3/02 (2013.01); H03H 9/0211 (2013.01); H03H 9/0504 (2013.01); H03H 9/09 (2013.01); H03H 9/54 (2013.01);
Abstract

A BAW device includes a substrate and a piezoelectric element formed on a surface of the substrate. The substrate has a plurality of elastic wave diffusing regions disposed therein for diffusing an elastic wave, the elastic wave diffusing regions being formed by modifying the inside of the substrate with a laser beam.


Find Patent Forward Citations

Abatake, Jun. (2018). Baw device and method of manufacturing baw device (U.S. Patent No. 10050599). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10050599

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…