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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10049988 B1

PDFFull Text
Date of Patent:
Aug. 14, 2018

Filed:

Mar. 02, 2017

Semiconductor device package substrate having a fiducial mark

Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventor:

Steven A. Atherton, Austin, TX (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:

Binh X Tran

Int. Cl.
CPC ...
H01B 13/00 (2006.01); H01L 23/544 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); C23F 1/00 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 23/535 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); C23F 1/00 (2013.01); H01L 21/4846 (2013.01); H01L 21/7685 (2013.01); H01L 21/76883 (2013.01); H01L 21/76885 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01L 23/528 (2013.01); H01L 23/535 (2013.01); H01L 23/5329 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01);
Abstract

A method for forming a semiconductor device package substrate including a fiducial mark is provided. The method of forming the package substrate includes forming a dielectric layer over a lower portion of the package substrate. A metal layer is formed over a fiducial region of the package substrate. The metal layer is etched to form a first signal line in the fiducial region. A passivation layer is formed over the first signal line. The passivation layer is etched over the first signal line to form a fiducial mark.

Find Patent Forward Citations

Atherton, Steven. (2018). Semiconductor device package substrate having a fiducial mark (U.S. Patent No. 10049988). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10049988

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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