The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Mar. 31, 2015
Applicants:

Imec Vzw, Leuven, BE;

Katholieke Universiteit Leuven, Ku Leuven R&d, Leuven, BE;

Inventors:

Roel Gronheid, St. Agatha Rode, BE;

Lieve Van Look, Leuven, BE;

Paulina Alejandra Rincon Delgadillo, Leuven, BE;

Assignee:

IMEC VZW, Leuven, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 11/30 (2006.01); G21C 17/00 (2006.01); G01N 21/956 (2006.01); G01N 21/47 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G01N 21/95607 (2013.01); G01N 21/47 (2013.01); G03F 7/0002 (2013.01); G01N 2201/12 (2013.01);
Abstract

A method for evaluating the quality of a directed self-assembling method used for generating directed self-assembling patterns. The method for evaluating comprises obtaining at least one set of parameter values for a parameterized set of processing steps and material properties characterizing the directed self-assembling method, thus characterizing a specific directed self-assembling method used for generating a directed self-assembled pattern. The method furthermore comprises obtaining a scattered radiation pattern on the directed self-assembled pattern obtained using the directed self-assembling method characterized by the set of parameter values, thus obtaining scattered radiation pattern results for the directed self-assembled pattern. The method furthermore comprises determining based on the scattered radiation pattern results a qualification score and correlating the qualification score with the set of parameter values.


Find Patent Forward Citations

Loading…