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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10047448 B1

PDFFull Text
Date of Patent:
Aug. 14, 2018

Filed:

Aug. 18, 2015

Tin-plated copper-alloy terminal material

Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Naoki Kato, Tokyo, JP;

Yuki Inoue, Aizuwakamatsu, JP;

Kiyotaka Nakaya, Naka, JP;

Assignee:

MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;

Attorneys:

Locke Lord LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Michael E La Villa

Int. Cl.
CPC ...
C25D 5/12 (2006.01); C25D 5/50 (2006.01); C25D 3/12 (2006.01); C25D 3/30 (2006.01); C25D 3/38 (2006.01); B32B 15/01 (2006.01); C22C 13/00 (2006.01); H01R 13/03 (2006.01); C23C 28/02 (2006.01); C23C 18/16 (2006.01); C23C 30/00 (2006.01); H01R 13/04 (2006.01); H01R 13/02 (2006.01);
U.S. Cl.
CPC ...
C25D 5/12 (2013.01); B32B 15/01 (2013.01); C22C 13/00 (2013.01); C23C 18/16 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C25D 5/50 (2013.01); C25D 5/505 (2013.01); H01R 13/02 (2013.01); H01R 13/03 (2013.01); H01R 13/04 (2013.01); B32B 2311/12 (2013.01); B32B 2311/16 (2013.01); B32B 2457/00 (2013.01); C25D 3/12 (2013.01); C25D 3/30 (2013.01); C25D 3/38 (2013.01); Y10T 428/1291 (2015.01); Y10T 428/12708 (2015.01); Y10T 428/12715 (2015.01); Y10T 428/12722 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12931 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/12993 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/24975 (2015.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01); Y10T 428/273 (2015.01);
Abstract

A tin-plated copper alloy terminal material in which an Sn-based surface layer is formed on a surface of a base material that is made of copper or a copper alloy, and a Cu—Sn alloy layer and an Ni layer or an Ni alloy layer are sequentially formed between the Sn-based surface layer and the base material from the Sn-based surface layer side: the Cu—Sn alloy layer is a layer that is formed only of an intermetallic compound alloy which is obtained by substituting some of Cu in CuSnalloy with Ni; and parts of the Cu—Sn alloy layer are exposed from the Sn-based surface layer, thereby forming a plurality of exposed portions; an average thickness of the Sn-based surface layer is from 0.2 μm to 0.6 μm (inclusive); and an area rate of the exposed portions of the Cu—Sn alloy layer relative to a surface area of is 1% to 40% (inclusive).

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