The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Dec. 08, 2011
Applicants:

Po-feng Tsai, Taipei, TW;

Chia-tong Ho, Taipei, TW;

Sunny Wu, Zhudong Town, TW;

JO Fei Wang, Hsin-Chu, TW;

Jong-i Mou, Hsinpu Township, Hsinchu County, TW;

Chin-hsiang Lin, Hsin-Chu, TW;

Inventors:

Po-Feng Tsai, Taipei, TW;

Chia-Tong Ho, Taipei, TW;

Sunny Wu, Zhudong Town, TW;

Jo Fei Wang, Hsin-Chu, TW;

Jong-I Mou, Hsinpu Township, Hsinchu County, TW;

Chin-Hsiang Lin, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2018.01); C23C 16/52 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
C23C 16/52 (2013.01); H01L 22/20 (2013.01); H01L 22/12 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method and system for removing control action effects from inline measurement data for tool condition monitoring is disclosed. An exemplary method includes determining a control action effect that contributes to an inline measurement, wherein the inline measurement indicates a wafer characteristic of a wafer processed by a process tool; and evaluating the inline measurement without the control action effect contribution to determine a condition of the process tool.


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