The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Jul. 21, 2015
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Takayuki Teshima, Yokohama, JP;
Arisa Oka, Tokyo, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 6/00 (2006.01); G21K 1/06 (2006.01); A61B 6/03 (2006.01); C25D 5/02 (2006.01); G21K 1/10 (2006.01);
U.S. Cl.
CPC ...
A61B 6/484 (2013.01); A61B 6/032 (2013.01); A61B 6/4035 (2013.01); C25D 5/02 (2013.01); G21K 1/062 (2013.01); G21K 1/067 (2013.01); G21K 1/10 (2013.01); G21K 2201/061 (2013.01); G21K 2201/067 (2013.01); G21K 2207/005 (2013.01);
Abstract
A structure includes a silicon substrate having a plurality of recessed portions, each recessed portion having a bottom and a side wall, silicide layers, each silicide layer in contact with the bottoms of the plurality of recessed portions, and a metal structure including metal portions, each metal portion disposed in the plurality of recessed portions and in contact with the silicide layers. The silicide layers are electrically connected to each other through the silicon substrate.