The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Dec. 13, 2016
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Huy Cao, Rexford, NY (US);

Zhiguo Sun, Halfmoon, NY (US);

Joseph F. Shepard, Jr., Poughkeepsie, NY (US);

Moosung M. Chae, Englewood Cliffs, NJ (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 21/764 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/7682 (2013.01); H01L 23/5329 (2013.01);
Abstract

The present disclosure relates to semiconductor structures and, more particularly, to airgaps which isolate metal lines and methods of manufacture. The structure includes: a plurality of metal lines formed on an insulator layer; and a dielectric material completely filling a space having a first dimension between metal lines of the plurality of metal lines and providing a uniform airgap with a space having a second dimension between metal lines of the plurality of metal lines. The first dimension is larger than the second dimension.


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Quick Actions:

Cao, Huy. (2018). Airgaps to isolate metallization features (U.S. Patent No. 10043753). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10043753

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