The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Aug. 23, 2016
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Perry Wyan Lou, Carlsbad, CA (US);
Sinan Goktepeli, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 21/8234 (2006.01); H01L 29/45 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/76889 (2013.01); H01L 21/76892 (2013.01); H01L 21/823475 (2013.01); H01L 23/66 (2013.01); H01L 29/456 (2013.01);
Abstract
An integrated circuit device may include a front-side contact coupled to a front-side metallization. The integrated circuit device may further include a backside contact coupled to a backside metallization. The front-side contact may be directly coupled to the backside contact.