The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Jun. 11, 2013
Shin-etsu Handotai Co., Ltd., Tokyo, JP;
Yuichi Shimizu, Nishigo-mura, JP;
SHIN-ETSU HANDOTAI CO., LTD., Tokyo, JP;
Abstract
A semiconductor-wafer evaluation method includes: before the mirror-polishing step, measuring warp data of displacement of the surface of the semiconductor wafer with a capacitive shape measurement device; setting a prescribed width of an outer circumferential portion of the semiconductor wafer as a sampling range; performing fitting of the warp data within the sampling range with a fitting function in a predetermined fitting range; calculating a difference (Range) between a maximum and a minimum of the warp data after the fitting within the sampling range; and, after the mirror-polishing step, evaluating the nanotopography of the surface of the semiconductor wafer on the basis of the calculated difference (Range).