The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2018

Filed:

May. 18, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Srinivasa Banna, San Jose, CA (US);

Sanjay Jha, San Diego, CA (US);

Deepak Nayak, Union City, CA (US);

Ajey P. Jacob, Watervliet, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/16 (2006.01); H01L 23/48 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/32 (2010.01); H01L 33/06 (2010.01); H01L 33/24 (2010.01); H01L 27/092 (2006.01); H01L 21/8258 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/481 (2013.01); H01L 24/08 (2013.01); H01L 25/50 (2013.01); H01L 21/8258 (2013.01); H01L 25/0753 (2013.01); H01L 27/0688 (2013.01); H01L 27/092 (2013.01); H01L 27/156 (2013.01); H01L 33/06 (2013.01); H01L 33/24 (2013.01); H01L 33/32 (2013.01); H01L 2224/08146 (2013.01);
Abstract

A display system is disclosed. The display system comprises a light emitting diode (LED) device and a backplane (BP) device. The LED device comprises a plurality of LEDs having LED terminals. An LED bonding surface comprising a dielectric layer with LED bonding surface contact pads is coupled to diode terminals of the LEDs. The backplane (BP) device comprises a BP substrate having top and bottom surfaces. A plurality of system on chip (SoC) chips are bonded to chip pads disposed on a bottom surface of the BP device. The SoC chips are electrically coupled to the CMOS components of the BP device and LEDs of the LED device.


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