The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2018
Filed:
Sep. 22, 2015
Applicant:
Win Semiconductors Corp., Tao Yuan, TW;
Inventors:
Assignee:
WIN Semiconductors Corp., Tao Yuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 23/3121 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/66 (2013.01); H01L 25/0657 (2013.01); H01L 23/49822 (2013.01); H01L 2224/48091 (2013.01); H01L 2225/06544 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18165 (2013.01);
Abstract
A package structure is disclosed. The package structure includes at least a lead, for delivering at least a signal; at least a routing layer, connected to the at least a lead, where at least a first hole is formed through the at least a routing layer; a die, disposed on the at least a routing layer, where at least a second hole is formed through the die, and the die generates or receives the at least a signal; and a molding cap, for covering the at least a routing layer and the die; where the at least a signal is delivered through the at least a first hole and the at least a second hole.