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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10037910 B1

PDFFull Text
Date of Patent:
Jul. 31, 2018

Filed:

Mar. 14, 2016

Wafer holder and method for manufacturing the same

Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Takuya Yanoh, Handa, JP;

Kazuma Ohba, Handa, JP;

Tetsuya Kawajiri, Handa, JP;

Hideyoshi Tsuruta, Tokai, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:

Burr & Brown, PLLC

Primary Examiner:

Stephen W Jackson

Int. Cl.
CPC ...
H01T 23/00 (2006.01); H01L 21/683 (2006.01); B29C 43/20 (2006.01); C04B 37/02 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); C04B 37/00 (2006.01); B29K 33/00 (2006.01); B29K 63/00 (2006.01); B29L 31/00 (2006.01); B29C 43/18 (2006.01); B29C 43/36 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); B29C 43/206 (2013.01); C04B 37/008 (2013.01); C04B 37/028 (2013.01); H01L 21/67103 (2013.01); H01L 21/6831 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01); B29C 43/18 (2013.01); B29C 2043/3644 (2013.01); B29K 2033/08 (2013.01); B29K 2033/12 (2013.01); B29K 2063/00 (2013.01); B29L 2031/7502 (2013.01); C04B 2235/96 (2013.01); C04B 2237/366 (2013.01); C04B 2237/402 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01);
Abstract

A wafer holderincludes a resin adhesive layerbetween a ceramic electrostatic chuckand a metal cooling plate. The adhesive layerincludes a first layerin contact with the electrostatic chuck, a second layerin contact with the cooling plate, and an intermediate layerlocated between the first layerand the second layer. Heat resistance of each of the first layerand the intermediate layeris higher than heat resistance of the second layer, flexibility of the second layeris higher than flexibility of each of the first layerand the intermediate layer, and the layers are in hermetic contact with each other.

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