The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2018
Filed:
Apr. 01, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Kabir J. Mirpuri, Scottsdale, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); B23K 35/36 (2006.01); B23K 101/40 (2006.01); H01L 23/488 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4864 (2013.01); B23K 35/3613 (2013.01); H01L 21/4853 (2013.01); H01L 23/49816 (2013.01); H05K 1/181 (2013.01); B23K 2201/40 (2013.01); B23K 2201/42 (2013.01); H01L 23/488 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H05K 1/11 (2013.01); H05K 2201/10462 (2013.01); H05K 2201/10674 (2013.01);
Abstract
A one-step water soluble (WS) flux process may reduce residue staining and increase yields for bond grid array (BGA) packages. In one example, the WS flux may use increased amounts of bonding polymer (BP) and reduced amounts of amine to increase viscosity. The increased viscosity may eliminate using a second no-clean flux and enable a single WS flux to both clean the associated substrate and provide stable solder ball support during reflow.