The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2018
Filed:
Jan. 07, 2015
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Toshiyuki Nagase, Gotemba, JP;
Hiroya Ishizuka, Sunto-gun, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01C 1/084 (2006.01); H01C 1/14 (2006.01); H01C 17/00 (2006.01); H01C 17/28 (2006.01); H01C 1/142 (2006.01); H01C 1/144 (2006.01); H01C 1/01 (2006.01);
U.S. Cl.
CPC ...
H01C 1/084 (2013.01); H01C 1/01 (2013.01); H01C 1/14 (2013.01); H01C 1/142 (2013.01); H01C 1/144 (2013.01); H01C 17/006 (2013.01); H01C 17/28 (2013.01); H01C 17/281 (2013.01); H01C 17/283 (2013.01); H01L 2224/40 (2013.01); H01L 2924/181 (2013.01);
Abstract
In this resistor, a heat sink (Al member) () and the other surface () of a ceramic substrate () are joined together using an Al—Si-based brazing filler material. The Al—Si-based brazing filler material has a melting point in a range of approximately 600° C. to 700° C. When the heat sink () and the ceramic substrate () are joined together using the Al—Si-based brazing filler material, it is possible to prevent the derogation of the heat resistance and thermal deterioration during joining at the same time.