The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Nov. 18, 2016
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Meng-Je Chuang, Hsin-Chu, TW;
Yu-Lin Sung, Taoyuan, TW;
Yi-Wei Chiu, Kaohsiung, TW;
Tzu-Chan Weng, Kaohsiung, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A semiconductor device, method, and tool of manufacture includes a semiconductor manufacturing tool. The semiconductor manufacturing tool includes push pins in a chuck and an edge ring over the chuck. The push pins are configured to hold a wafer, and are operable to vary a height of the wafer with respect to the chuck. The edge ring has a first width at a base proximate the chuck, and a second width at a point distal the chuck. The first width is greater than the second width. A distance from the wafer to the edge ring varies when the push pins vary the height of the wafer with respect to the chuck.