The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Sep. 30, 2016
Applicant:

Tessera, Inc., San Jose, CA (US);

Inventors:

Belgacem Haba, Saratoga, CA (US);

Vage Oganesian, Sunnyvale, CA (US);

Kimitaka Endo, Tokyo, JP;

Assignee:

Tessera, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 25/16 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/16 (2013.01); H05K 3/4038 (2013.01); H05K 3/4647 (2013.01); H01L 2224/24226 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/30107 (2013.01); H05K 1/185 (2013.01); H05K 3/0038 (2013.01); H05K 3/4652 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0361 (2013.01); H05K 2201/0382 (2013.01); H05K 2201/096 (2013.01); H05K 2203/0384 (2013.01); H05K 2203/0733 (2013.01); H05K 2203/1189 (2013.01);
Abstract

An interconnect elementcan include a dielectric layerhaving a top faceand a bottom faceremote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, or both, can include a plurality of conductive traces. A plurality of conductive protrusionscan extend upwardly from the plane defined by the first metal layerthrough the dielectric layer. The conductive protrusionscan have top surfacesat a first heightabove the first metal layerwhich may be more than 50% of a height of the dielectric layer. A plurality of conductive viascan extend from the top surfacesof the protrusionsto connect the protrusionswith the second metal layer.


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