The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Aug. 19, 2013
Applicants:

Yuichi Ogawa, Tokyo, JP;

Haruyoshi Yamakawa, Tokyo, JP;

Inventors:

Yuichi Ogawa, Tokyo, JP;

Haruyoshi Yamakawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B08B 3/10 (2006.01); C25B 15/08 (2006.01); C25B 1/28 (2006.01); H01L 21/3213 (2006.01); H01L 21/67 (2006.01); H01L 21/28 (2006.01); C25F 1/00 (2006.01); H01L 21/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02068 (2013.01); B08B 3/10 (2013.01); B08B 3/102 (2013.01); C25B 1/285 (2013.01); C25B 15/08 (2013.01); C25F 1/00 (2013.01); H01L 21/28088 (2013.01); H01L 21/32134 (2013.01); H01L 21/67017 (2013.01);
Abstract

A cleaning method including a persulphuric acid producing step of causing a cleaning sulfuric acid solution to travel into an electrolyzing section and to circulate therethrough to produce persulphuric acid having a predetermined concentration by electrolysis in the electrolyzing section, a solution mixing step of mixing the sulfuric acid solution containing the persulphuric acid produced in the persulphuric acid producing step with a halide solution containing one or more types of halide ion without causing the solutions to travel into the electrolyzing section to produce a mixed solution having a post-mixture concentration of oxidant including the persulphuric acid that ranges from 0.001 to 2 mol/L, a heating step of heating the mixed solution, and a cleaning step of cleaning a semiconductor substrate by transporting the heated mixed solution to cause the heated mixed solution to come into contact with the semiconductor substrate.


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