The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

Jul. 29, 2014
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Phi Hung Thanh, Aloha, OR (US);

Paul J. Diglio, Chandler, AZ (US);

John C. Johnson, Phoenix, AZ (US);

Jarett L. Rinaldi, Phoenix, AZ (US);

Arnab Choudhury, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); F28F 1/10 (2006.01); F28F 3/12 (2006.01); F28F 13/06 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
F28F 1/10 (2013.01); F28F 3/12 (2013.01); F28F 13/06 (2013.01); H01L 23/473 (2013.01);
Abstract

A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.


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