The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Dec. 23, 2014
Applicant:
Shengyi Technology Co., Ltd., Guangdong, CN;
Inventors:
Xianping Zeng, Guangdong, CN;
Nana Ren, Guangdong, CN;
Assignee:
SHENGYI TECHNOLOGY CO., LTD., , CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/02 (2006.01); C08L 79/04 (2006.01); H05K 1/03 (2006.01); C08J 5/24 (2006.01); B32B 5/26 (2006.01); B32B 15/14 (2006.01); C08K 5/00 (2006.01); C08L 63/00 (2006.01); C08L 85/02 (2006.01); C08G 73/06 (2006.01);
U.S. Cl.
CPC ...
B32B 5/024 (2013.01); B32B 5/022 (2013.01); B32B 5/26 (2013.01); B32B 15/14 (2013.01); C08J 5/24 (2013.01); C08K 5/0033 (2013.01); C08L 63/00 (2013.01); C08L 79/04 (2013.01); C08L 85/02 (2013.01); H05K 1/0353 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/10 (2013.01); B32B 2307/306 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/7265 (2013.01); B32B 2457/08 (2013.01); C08G 73/0655 (2013.01); C08J 2379/00 (2013.01); C08J 2485/02 (2013.01); H05K 1/0366 (2013.01); H05K 2201/012 (2013.01); Y10T 428/31507 (2015.04); Y10T 428/31529 (2015.04); Y10T 428/31605 (2015.04);
Abstract
The present invention relates to a thermosetting resin composition, which comprises: (A) cyanate ester compound and/or cyanate ester prepolymer; and (B) polyphosphonate ester and/or phosphonate-carbonate copolymer. The thermosetting resin composition provided by the present invention has low dielectric constant and dielectric loss tangent. The prepreg and copper clad laminate made from the above-mentioned thermosetting resin composition have excellent dielectric properties and wet-heat resistance, UL94 V-0 flame resistance, and good processability.