The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Dec. 20, 2016
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventors:
Luke England, Saratoga Springs, NY (US);
Rahul Agarwal, Waterford, NY (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 33/30 (2010.01); H01L 33/32 (2010.01); H01L 33/28 (2010.01); F21V 19/00 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/80 (2013.01); H01L 25/167 (2013.01); H01L 33/28 (2013.01); H01L 33/30 (2013.01); H01L 33/32 (2013.01); F21V 19/005 (2013.01); F21Y 2115/10 (2016.08); H01L 2224/80896 (2013.01);
Abstract
The present disclosure relates to semiconductor structures and, more particularly, to wafer bond interconnect structures and methods of manufacture. The structure includes: a plurality of sub-pixels each comprising a contact plate; and redundant connections at opposite corners of each sub-pixel on a backside of the contact plate.
England, Luke. (2018). Wafer bond interconnect structures (U.S. Patent No. 10026883). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10026883
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile