The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Dec. 11, 2012
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventor:
Ying-Zhong Chen, New Taipei, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/36 (2010.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 33/62 (2010.01); H01L 23/24 (2006.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/495 (2013.01); H01L 21/56 (2013.01); H01L 23/24 (2013.01); H01L 33/62 (2013.01); H01L 23/49861 (2013.01); H01L 33/486 (2013.01); H01L 33/64 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/3011 (2013.01);
Abstract
The present invention relates to a semiconductor lead frame package and LED package. The semiconductor lead frame package includes a die pad, a lead, a die and an insulator body. The lead is electrically isolated from the die pad. The die is disposed on the die pad and electrically connected to the lead. The insulator body partially encapsulates the die pad and the lead, and has a top surface and a bottom surface, wherein a part of the lead is folded onto the top surface of the insulator body.