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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10026676 B1

PDFFull Text
Date of Patent:
Jul. 17, 2018

Filed:

Dec. 11, 2012

Semiconductor lead frame package and led package

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventor:

Ying-Zhong Chen, New Taipei, TW;

Assignee:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Attorney:

Klein, O'Neill & Singh, LLP

Primary Examiner:

Cuong B Nguyen

Int. Cl.
CPC ...
H01L 33/36 (2010.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 33/62 (2010.01); H01L 23/24 (2006.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/495 (2013.01); H01L 21/56 (2013.01); H01L 23/24 (2013.01); H01L 33/62 (2013.01); H01L 23/49861 (2013.01); H01L 33/486 (2013.01); H01L 33/64 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/3011 (2013.01);
Abstract

The present invention relates to a semiconductor lead frame package and LED package. The semiconductor lead frame package includes a die pad, a lead, a die and an insulator body. The lead is electrically isolated from the die pad. The die is disposed on the die pad and electrically connected to the lead. The insulator body partially encapsulates the die pad and the lead, and has a top surface and a bottom surface, wherein a part of the lead is folded onto the top surface of the insulator body.

Find Patent Forward Citations

Chen, Ying-Zhong. (2018). Semiconductor lead frame package and led package (U.S. Patent No. 10026676). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10026676

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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